VeriSilicon touts shift from fab lite to design lite
Junko Yoshida, EETimes
9/4/2012 5:50 PM EDT
SHANGHAI – If you think chip companies are popping up everywhere in China, producing a flood of me-too products based on me-too business models, well, think again. VeriSilicon doesn’t fit the stereotype and defies many preconceived notions about Chinese technology companies.
Headed by Wayne Dai, one of the best connected executives in China and Silicon Valley, VeriSilicon is pitching a “design lite” strategy to potential global partners. Just as the wafer-foundry business model freed many IC companies from manufacturing internally designed chips using their own fabs, Dai promotes a “design foundry” business model. The model aims to free chip vendors from designing all elements of a customer’s SoC from scratch.
A new breed of fabless, designless chip companies may not sit well with traditional vendors, but the design lite model may nevertheless be just what the doctor ordered for an industry in transition.
In essence, VeriSilicon offers an antidote to the costly custom consumer SoC business. The nature of the high risk, low margin custom SoC business has brought companies like Renesas Electronics to its knees. Renesas has little choice but to leave the audio visual/multimedia sector of the SoC business. Noting the tremendous pressure from competitors in Taiwan and Korea, VeriSilicon’s Dai said: “It’s time for Japan to work with the Chinese.”
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Verisilicon, Inc. Hot IP
Related News
- SMIC revamps fab deals, confirms capital infusion
- MagnaChip Semiconductor Announces Definitive Agreement To Sell Foundry Business and Fab 4
- Arteris IP Supports Dream Chip Technologies Innovative Business Model for Automotive SoC Development
- SiFive Launches CPU IP Industry into the Cloud with New RISC-V Cores and an Easy Online Business Model
- Tronics Expands its Business Model to Mobile and Wearable Applications with the Licensing of its Combo Sensors Based on Disruptive Magelan and M&NEMS Technologies
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset