Cypress forms alliance and invests in MRAM IP developer NVE
![]() |
Cypress forms alliance and invests in MRAM IP developer NVE
By Semiconductor Business News
April 24, 2002 (4:33 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020424S0034
SAN JOSE - Cypress Semiconductor Corp. here today announced that it has struck a technology alliance and invested in NVE Corp., a developer of intellectual-property (IP) based on magnetic random-access memory (MRAM) technology. Under the terms, Cypress invested $6.228 million in NVE in exchange for 3.433 million shares of NVE common stock, with an option to buy up to an additional two million shares for $3.00 per share. The companies will also gain rights to each other's MRAM technologies. Cypress also agreed to manufacture wafers for NVE of Eden Prairie, Minn. "NVE's technology will help speed our development of next-generation electronic components," said Cypress President and CEO T. J. Rodgers. "This alliance solidifies our capital structure, gives us a powerful MRAM ally, and augments our product manufacturing capability," said NVE President and Chief Executive Officer Daniel A. Baker. Unlike conventional DRAM and SRAM memories , which lose data when power is off, MRAM uses "spintronic" magnetic materials that retain data when power is removed. In addition to Cypress, NVE has technology agreements with Agilent, Motorola, and Honeywell International (NYSE:HON). NVE retains the right to license its technology to other companies.
Related News
- Intel Foundry Services Forms Alliance to Enable National Security, Government Applications
- Intel Foundry Services Forms Alliance to Enable Design in the Cloud
- CHIPS Alliance Forms F4PGA Workgroup to Accelerate Adoption of Open Source FPGA Tooling
- European Commission forms processor, semiconductor alliance
- Andes Technology forms a Multinational Alliance with ASIC Design Service Companies to Provide RISC-V Total Solutions
Breaking News
- Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
- Quadric Announces Lee Vick is New VP Worldwide Sales
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |