USB-IF Reaches SuperSpeed USB Certification Milestone, Industry-Wide Adoption
Certified SuperSpeed USB (USB 3.0) products more than double within one year
SAN FRANCISCO-- September 11, 2012 --Today at the Intel Developer Forum (IDF), the USB Implementers Forum (USB-IF) announced the number of certified SuperSpeed USB (USB 3.0) products more than doubled within one year, with 590 certified SuperSpeed USB products on the market.
“The SuperSpeed USB ecosystem experienced unparalleled growth and advancement this year, and we will continue to see a fast and steady increase in the number of certified SuperSpeed USB products,” said Jeff Ravencraft, USB-IF President & COO. “The USB-IF continues to deliver specifications that enable products to exceed consumer expectations.”
With SuperSpeed USB achieving industry-wide adoption, USB will continue to be relevant today and in the future. The USB 3.0 Promoter Group has developed additional specifications to expand USB applications across new platforms. The USB Power Delivery specification and USB Audio/Visual specification help simplify the lives of consumers by providing a seamless computing experience. Additionally, the SuperSpeed USB Inter-Chip (SSIC) specification and the Mobile Broadband Interface Model (MBIM) specification extend USB applications for mobile devices.
“The rapid growth in the number of certified SuperSpeed USB products expands the range of options for consumers seeking fast, affordable and easy-to-use technology,” observed Nathan Brookwood, Research Fellow at Insight 64. “I’m confident the latest additions to the USB specs will enable designers and manufacturers to expand that range of options even more over the next few years.”
The USB-IF and member companies will showcase the latest SuperSpeed USB developments during IDF being held September 11-13, 2012 in San Francisco, Calif. To learn more about SuperSpeed USB, visit www.usb.org.
About SuperSpeed USB
SuperSpeed USB brings significant performance enhancements to the ubiquitous USB standard, while remaining compatible with the billions of USB-enabled devices currently deployed in the market. SuperSpeed USB delivers up to 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency. SuperSpeed USB offers effortless video streaming, music and photos at your home, office, car and anywhere in between. The USB 3.0 specification was developed by the USB 3.0 Promoter Group, which consists of Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST-Ericsson and Texas Instruments.
About the USB-IF
The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology. USB-IF facilitates the development of high-quality, compatible USB devices through its logo and compliance program recognized around the globe and promotes the benefits of USB and the quality of products that have passed compliance testing. Further information, including postings of the most recent product and technology announcements, is available by visiting the USB-IF website at www.usb.org.
|
Related News
- USB-IF Certifies 1,000 SuperSpeed USB (USB 3.0) Products
- Cypress Announces USB-IF Certification of SuperSpeed USB 3.0 Controllers
- Synopsys' DesignWare SuperSpeed USB 3.0 xHCI Host Controller IP Receives USB-IF Certification
- Fresco Logic Announces USB-IF Certification for its 2nd Generation SuperSpeed USB Host Controller FL1009
- GDA (L&T Infotech) Pravega SuperSpeed USB (USB 3.0) IP Receives USB-IF Certification
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |