English
Intel sees quad-patterned path to 10 nm chips
Rick Merritt, EETimes
9/12/2012 11:00 PM EDT
SAN FRANCISCO – Intel Corp. has found a way to create a 10 nm process technology using immersion lithography. In addition, the processor giant is on track to start making chips in a 14 nm process technology before the end of next year, said an Intel fellow in a talk here.
The 10 nm process would debut in 2015 or later. It would require quadruple patterning for some mask layers but “it’s still economical,” said Mark Bohr, director of Intel’s technology and manufacturing group, speaking to EE Times after a talk at the Intel Developer Forum here.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
- Intel Reports Tepid Progress on 10 nm
- Intel Technology and Manufacturing Day in China Showcases 10 nm Updates, FPGA Progress and Industry's First 64-Layer 3D NAND for Data Center
- Intel Unveils 10, 22nm Processes
- Altera Achieves Industry Milestone: Demonstrates FPGA Technology Based on Intel 14 nm Tri-Gate Process
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity