Intel sees quad-patterned path to 10 nm chips
Rick Merritt, EETimes
9/12/2012 11:00 PM EDT
SAN FRANCISCO – Intel Corp. has found a way to create a 10 nm process technology using immersion lithography. In addition, the processor giant is on track to start making chips in a 14 nm process technology before the end of next year, said an Intel fellow in a talk here.
The 10 nm process would debut in 2015 or later. It would require quadruple patterning for some mask layers but “it’s still economical,” said Mark Bohr, director of Intel’s technology and manufacturing group, speaking to EE Times after a talk at the Intel Developer Forum here.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
- Intel Reports Tepid Progress on 10 nm
- Intel Technology and Manufacturing Day in China Showcases 10 nm Updates, FPGA Progress and Industry's First 64-Layer 3D NAND for Data Center
- Intel Unveils 10, 22nm Processes
- Altera Achieves Industry Milestone: Demonstrates FPGA Technology Based on Intel 14 nm Tri-Gate Process
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era