Sunplus Achieves Volume Shipments of New Home Entertainment SoCs powered by the CEVA-TeakLite-III Audio DSP
CEVA-powered HD Set-Top-Box and HD DTV SoCs from Sunplus now shipping in multiple OEM products; Complete HD audio capabilities enabled by a single CEVA-TeakLite-III DSP core
MOUNTAIN VIEW, Calif. - September 19, 2012 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Sunplus Technology Co., Ltd. has achieved volume shipments of a range of home entertainment SoCs which utilize the CEVA-TeakLite-III DSP for HD audio processing. These new SoCs are embedded in multiple HD DTV and Set-Top-Box OEM products, bringing affordable, high performance audio and video capabilities to the mass market.
“The CEVA-TeakLite-III DSP has proven to be an outstanding solution for our HD audio requirements, enabling us to support a broad array of high performance audio codecs on a single core,” said Dr. Archie Yeh, president of Sunplus. “The ease of programming of the CEVA-TeakLite-III architecture, coupled with its robust silicon-based software development kit, enabled us to quickly develop and certify our HD audio software for our home entertainment SoCs.”
“We are delighted to see the speed with which Sunplus reached volume shipments of their home entertainment SoCs powered by a single CEVA-TeakLite-III DSP core,” said Eran Briman, vice president of marketing at CEVA. “This is a clear testimony to the exceptional audio performance that the powerful CEVA-TeakLite-III provides, as well as the ease of use of our world-class software development environment. We look forward to continued success with this world-leading multimedia SoC provider.”
The CEVA-TeakLite-III is a member of the CEVA-TeakLite DSP family, the most successful licensable DSP family in the history of the semiconductor industry, with more than 2 billion chips shipped, over 100 licensees, 25 active ecosystem partners and more than 100 audio and voice codecs and enrichment applications available. It is widely deployed in home entertainment SoCs, mobile application processors and audio CODEC chips, handling advanced audio and voice scenarios. To learn more about the CEVA-TeakLite DSP family, visit http://www.ceva-dsp.com/CEVA-TeakLite-Family.html
About Sunplus
Sunplus Technology Co., Ltd., established in 1990, is a leading provider of multimedia IC solutions to home entertainment platforms for DVD players, Set-Top-Boxes, LCD TVs and Digital TVs and upcoming high definition home entertainment products such as BD players, HD Set-Top-Boxes and Full-HD Digital TVs. Sunplus multimedia ICs and system solutions enable customers to build digital home entertainment products with superior quality and performance. Sunplus is headquartered in Taiwan and has service offices in Hong Kong, Shanghai, Shenzhen and Chengdu. For more information, please visit Sunplus website at www.sunplus.com.
About CEVA, Inc.
CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over 1 billion devices and powers handsets from every top handset OEM, including Nokia, Samsung, HTC, LG, Motorola, Sony, Huawei and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
|
Ceva, Inc. Hot IP
Related News
- Novatek in Volume Production with Three New Home Entertainment SOCs Using Tensilica HiFi Audio DSP
- CEVA-TeakLite-III DSP Core Powers HD Audio in Sunplus' New Blu-ray SoCs
- Tensilica HiFi Audio DSP Supports Dolby Volume to Eliminate Volume Fluctuations in Home Entertainment Systems and DTVs
- Novatek Adopts CEVA Audio/Voice DSP and Software for Smart TV SoCs
- Tensilica's HiFi 3 DSP IP Core Provides Over 1.5x Better Performance for Audio Post Processing and Voice in Smartphones and Home Entertainment
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |