Dolphin Integration measures 15% area reduction on 65 nm logic circuit with its 6-Track standard cell library

Grenoble, France – September, 21 2012 -- Dolphin Integration today announced the availability of benchmark results on real conditions at TSMC 65 nm LP process, comparing its SESAME uHD-BTF DV standard cell with a 7-Track library:

Highlights:

• SESAME uHD-BTF DV standard cell is 9% to 15% denser after P&R compared to standard 7-Track Library
• Leakage power is reduced 6 times in worst case conditions (SS; 1.08 V; -40°C)
• Low Voltage Capability for additional power savings when operating down to 0.9 V +/-10%

SESAME uHD-BTF DV benefits from replacing classical D flip-flops with pulsed latches acting as “spinner cells”. The main advantage of the spinner cell is a significant improvement in terms of density, 30% compared with D flip-flops!

More information on the key benefits of SESAME uHD-BTF DV standard cell library is available directly on the Presentation sheet

To request an access to the evaluation kit of SESAME uHD-BTF DV standard cell, contact sesame@dolphin-integration.com 

About Dolphin Integration

Dolphin Integration is up to their charter as the most adaptive and lasting creator in the Microelectronics Design Industry to "enable mixed signal Systems-on-Chip". It stars a quality management stimulating reactivity for innovation as well as independence and partnerships with Foundries. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, such as mixed signal high-resolution converters for audio and measurement applications, Libraries of memories and standard cells, Power management networks, Microcontrollers. The strategy is to follow product launches with evolutions addressing future needs, emphasizing resilience to noise and drastic reductions of power-consumption at SoC level, thanks to their own missing EDA solutions enabling Support Engineering with Application Hardware Modeling as well as early Power and Noise assessment, plus engineering assistance for Risk Control

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