English
Intel, rivals gird for IC manufacturing showdown
Peter Clarke, EETimes
9/24/2012 1:00 PM EDT
LONDON – Chip giant Intel and the research partnership clustered around IBM and STMicroelectronics are each set to report progress on their approaches to leading-edge IC manufacturing during the International Electron Devices Meeting (IEDM) in San Francisco in December.
Research teams are set to present on the FinFET approach--called tri-gate by Intel--on fully-depleted silicon-on-insulator (FDSOI) and on bulk planar processes at around 20 nm and beyond.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process
- Intel Custom Foundry Certifies Mentor Graphics Physical Verification and Circuit Simulation Tools for 10nm Tri-Gate Process
- Intel Custom Foundry Certifies Synopsys Implementation and Signoff Tools for 10-nm Tri-Gate Process
- Cadence and Intel Collaborate to Enable a 14nm Tri-gate design Platform for Customers of Intel Custom Foundry
- Synopsys and Intel Collaborate to Enable 14-nm Tri-Gate Design Platform for Use by Customers of Intel Custom Foundry
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset