InterDigital and ASOCS Team to Deliver WCDMA/GGE IP Core Solution
WILMINGTON, Del.-- October 3, 2012-- InterDigital, Inc. (NASDAQ: IDCC) and ASOCS Ltd., a provider of many-core embedded processors, today announced a strategic alliance that will see the integration of InterDigital's SlimChip WCDMA modem IP core and ASOCS' ModemX® platform and R4 GSM/GPRS/EDGE solution. The result: a fully-integrated 2G and 3G modem technology with an upgrade path to HSPA+, TD-SCDMA, and LTE.
This combined offering is designed to provide customers with a technology that can be embedded into wireless product platforms or produce a viable chipset solution in less than a year, while significantly reducing development risk and time to market. The solution will be ideal for customers integrating GSM/WCDMA into multi-mode design with LTE or TD-SCDMA, or companies seeking to enter new market areas while reducing development costs and time.
The combined offerings of ASOCS and InterDigital result in the SlimChip modem IP core transfer package, which includes a complete 3GPP Release 6 compliant 3G physical layer (with direct upgrade path to Release 7), Release 4 compliant 2G physical layer and dual mode protocol stack implementation. The offering supports HSPA Category 10 (14.4 Mbps DL) and Category 6 (5.76 Mbps UL) as well as GPRS/EGPRS multi-slot class 12.
"The path to new product introduction in wireless can be very challenging and, given the speed with which new players are emerging, any slowdown or mishap can have significant consequences for market penetration. The combined solution by ASOCS and InterDigital is based on proven market-ready technologies, and should enable customers to roll out products quickly and effectively while building an upgrade path to 4G technologies into their roadmap," said Bill Miller, Executive Vice President of IP Sales and Services at InterDigital.
"The strategic alliance with InterDigital is an important milestone in our new strategy towards proliferation of our ModemX technology in the mobile world," said Gilad Garon, Chief Executive Officer of ASOCS. "ModemX is displacing the traditional DSP approach, with a one stop shop of flexibility and performance needed in today's low power designs. Our softwareprogrammable architecture makes it easy for customers to quickly react to changes in their product roadmaps."
About InterDigital®
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and strategic relationships with many of the world's leading wireless companies. For more information, visit: www.interdigital.com. InterDigital is a registered trademark of InterDigital, Inc.
For more information, visit the InterDigital website: www.interdigital.com.
About ASOCS
Founded in 2003, ASOCS develops and markets many-core embedded processors that enable full software programmability of physical layer functions and algorithms. The ModemX® family of cores represents a revolutionary approach to communications and runs multiple, distinctly different communication air-interfaces concurrently on a single platform. ASOCS solutions cover a variety of mobile solutions, both for terminals and mobile network infrastructure, as well as other wireless and broadband standards.
For more information, visit the ASOCS website: www.asocstech.com
|
Related News
- ASOCS and CMCC team up to deliver mass market high capacity, commercially viable C-RAN solutions
- InterDigital to Deliver SlimChip Modem Core to New Entrant to Mobile Chipset Market in China
- GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
- Arteris and SiFive Deliver Pre-verified Solution for the Datacenter Market
- TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
Breaking News
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Most Popular
- Arm's power play will backfire
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era
E-mail This Article | Printer-Friendly Page |