Hisense Picks Tensilica's HiFi Audio/Voice DSP and Software Codecs for DTVs

Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)

SANTA CLARA, Calif. USA – October 9, 2012 –Tensilica, Inc., today announced that Hisense Company Ltd., of Qingdao, China, is using the Tensilica HiFi Audio/Voice DSP (digital signal processor) to do all of the audio decoding and post processing in its new SOCs (system on chips) for DTV (digital televisions). Tensilica’s HiFi Audio/Voice DSP is the most popular audio IP core on the market, with the lowest power and largest library of over 100 ported software codecs.

“For product differentiation, we decided to design our own DTV chips and we needed an audio DSP that was compatible with all of the possible worldwide audio standards, and would offer the highest level of sound fidelity with the most efficient power and area,” stated Liu Weidong, general manager of HiView, Hisense’s IC design subsidiary. “Tensilica’s HiFi Audio is the leading IP core and has the largest library of audio codecs and audio/voice pre- and post-processing software ported and optimized for it. It is making our design efforts much easier.”

“Hisense is gaining market share around the world with its cost-effective DTV designs,” stated Larry Przywara, Tensilica’s senior director of multimedia marketing. “Hisense has continuously enhanced both its audio and video quality and we are pleased they have selected Tensilica to achieve the highest level of sound fidelity. We look forward to their first TVs with our audio DSPs hitting the market next year.”

Tensilica’s HiFi Audio DSPs have been selected by leading DTV manufacturers around the world and they are the leading licensable audio DSP IP cores, licensed by over 50 customers including half of the top 20 semiconductor manufacturers and many leading system OEMs. The HiFi Audio DSPs support over 100 audio and voice codecs with very efficient processing at low power and they are part of Tensilica’s growing line of DPUs (dataplane processors) that efficiently do the challenging, compute-intensive tasks in SOC designs.

About Hisense Company Ltd.

Hisense Company Ltd. is a multinational electronics manufacturer headquartered in Qingdao, China. Hisense manufactures and markets 3DTVs, Smart TVs and LED TVs, as well as other consumer products. More information is available at www.hisense.com.

About Tensilica

Tensilica, Inc. is the leader in customizable dataplane processor IP cores with almost 200 core licensees. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to 100x the performance because they can be customized using Tensilica’s automated design tools to meet specific signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.