Think Silicon GPUs power latest Dialog Semiconductor VOIP chipsets
Patras, Greece, November 15th, 2012. Think Silicon Ltd, today announced that Dialog Semiconductor uses ThinkVG, a Graphics Processing Unit to get Graphics power in it's new series of products. ThinkVG is integrated in the recently announced Green VoIP™ “SC14453” multicore system-on-chip (SoC) along with ThinkLCD Display Processor that enables rendering of fluid graphic user interfaces onto touchscreen LCD displays.
ThinkVG is the smallest Graphics Processing Unit (GPU) in the market supporting the Khronos Group OpenVG 1.1 standard. It is an extremely low-gate count IP Core based on VShader, a C/C++ programmable Floating Point SIMD Streaming processor, designed for graphics applications. System Architecture is Scalable and embedded software allows flexibility. ThinkVG comes complete with Software Library implementing OpenVG 1.1 running on VShader and with API package running on host processor with emphasis on minimizing CPU overhead by the use of command lists and on reducing memory bandwidth by utilizing custom image compression hardware.
“ThinkVG is developed to support OpenVG having in mind to provide a very compact and low power solution for embedded devices that require fast 2.5D Graphics Rendering” said George Sidiropoulos, Managing Director of Think Silicon. “We focused on designing Unified Shading Architecture assisted by a balanced pipeline that would achieve the highest throughput per gate ratio due to high component reusability and at the same time offer scalability for different standards and performance levels in the future.”
René Kohlmann, Senior Director for Dialog’s Low Energy Wireless and VoIP Business Development, comments: “In close cooperation with Think Silicon, Dialog successfully integrated the ThinkVG graphical process unit in its latest high end VoIP processor the SC14453.” ThinkVG is available today and can be complemented with ThinkLCD/ML, a multilayer Display controller and Think2D/MJPEG, a 2D Composition Engine with optional built-in MJPEG decoder features.
About Think Silicon Ltd
Think Silicon specializes in designing and developing Intellectual Property Semiconductor Cores in the field of Computer Graphics for mobile/embedded devices including silicon design, API software libraries for industry standards like DirectFB and the Khronos Group OpenGL-ES, OpenVG, OpenCL, and OS drives. Think Silicon markets ThinkLCD/ML Multilayer Display controllers, Think2D/2.5D a high performance 2.5D Graphics Acceleration and composition engine, and ThinkVG, a compact GPU for Vector Graphics. Think Silicon provides complete Graphics IP solutions and becomes part of partners' product roadmap. Please visit: www.think-silicon.com
|
Think Silicon Ltd Hot IP
Related News
- Think Silicon and Ambiq Enable Ultra-Low Power IoT Devices with Smartphone-Class, 3D-Like Graphics
- Latest Imagination PowerVR Series8XE GPUs set new standard for performance, power and area in cost-sensitive markets
- Think Silicon Launches NEMA|PICO The World Smallest, Most Ultra-Low Power and Cost Efficient 2D GPU at CES 2016
- Think Silicon Launches Industry's Smallest Ultra-Low Power 3D GPU
- Synopsys DFTMAX Ultra Deployed By Dialog Semiconductor to Successfully Test Silicon Parts
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |