ARM CEO Warren East on IoT, Nokia, platforms, Europe's future
Peter Clarke, Brian Fuller
EETimes (11/21/2012 2:54 PM EST)
SANTA CLARA, Calif. – ARM CEO Warren East said Internet of Things applications could double the company's market size, he wouldn't "bet against" Nokia and his company is envisioning future technology evolution by building internal platforms.
In a wide-ranging interview at ARM TechCon, EE Times asked East about how the company is adapting to better serve its increasing domain breadth that now ranges from servers, through mobile clients and down to the Internet of Things (IoT).
"The Internet of Things for us is about the sale of microcontrollers. We think it is likely to follow a similar path to mobile phones."
East explained that the first microprocessors in cell phones were 32-bit devices that were required to spend most their time running the cellular communications protocol. The processor clock cycles that became available when the phone was not being used for a call were put to uses running early games on tiny displays. Now we are used to multiple processor cores on an SOC, and multiple processor chips in a mobile phone; a modem chip, an application processor, a connectivity chip.
So East expects a move to multiple cores in MCUs. "That alone would double the market size for ARM," he said.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Arm Ltd Hot IP
Related News
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era