Lattice Semiconductor Updates 4Q12 Revenue Guidance
Dec 12, 2012 -- Lattice Semiconductor Corporation (NASDAQ: LSCC) today updated its revenue guidance for the fourth quarter ending December 29, 2012 to reflect weakness in the communications market combined with continued weakness in the worldwide distribution channel. Guidance remains unchanged for gross margin and total operating expenses.
- Revenue for the fourth quarter 2012 is now expected to decline approximately 6% to 8% on a sequential basis. This compares to prior guidance provided on October 18, 2012 that revenue was expected to be approximately plus or minus 2% on a sequential basis.
- Gross margin percentage is expected to be approximately 53% plus or minus 2%. This is unchanged from prior guidance.
- Total operating expenses are expected to be approximately $43 million, including approximately $5.5 million in restructuring charges. This is unchanged from prior guidance.
No conference call will be held in conjunction with this guidance update. Additional information will be available when the Company reports its fourth quarter 2012 results.
About Lattice Semiconductor
Lattice is a service-driven developer of innovative low cost, low power programmable design solutions. For more information about how our FPGA, CPLD and programmable power management devices help our customers unlock their innovation, visit www.latticesemi.com.
|
Related News
- Lattice Semiconductor Updates 1Q13 Guidance
- Lattice Semiconductor Updates 2Q12 Guidance
- Lattice Semiconductor Reports First Quarter 2011 Results; Exceeds High-End of Prior Revenue Guidance
- Lattice Semiconductor Updates Guidance for Third Quarter 2009
- Lattice Semiconductor Updates Guidance for First Quarter
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |