Sony and InterDigital Team to Launch Machine-to-Machine Focused Joint Venture Called Convida Wireless
NEW YORK & WILMINGTON, Del.-- January 3, 2013 -- InterDigital, Inc. (NASDAQ: IDCC) and Sony Corporation of America (NYSE: SNE) today announced the launch of a joint venture to combine Sony's consumer electronics expertise with InterDigital's pioneering wireless machine-to-machine (M2M) and bandwidth management research. The joint venture, called Convida Wireless, will focus on driving new research in the growing field of M2M wireless communications and other connectivity areas.
Convida Wireless represents a new collaboration between Sony, a longtime technology leader, and InterDigital Solutions, a unit announced in October by InterDigital that explores new engagement models with industry players. Based on the terms of the agreement, the parties will contribute funding and resources for additional M2M research and platform development, which will be carried out by InterDigital Solutions. Stephens Capital Partners LLC, the principal investing affiliate of Stephens Inc., a full service investment banking firm headquartered in Little Rock, Arkansas, will be a minority investor in Convida Wireless. The agreement also includes a patent license from InterDigital for Sony's 3G and 4G products.
"Mobile is one of Sony's core businesses, and this joint venture will help us strengthen our foundation in this important area, focusing specifically on machine-to-machine wireless technologies. Given the pioneering efforts of InterDigital's engineers in this growing field, we can't think of a better partner," said Toshimoto Mitomo, Executive Vice President of Entrepreneurship and Innovation, Sony Corporation of America. "Moreover, in a market that is by its very nature collaborative, we expect Convida Wireless to be a platform for additional industry collaboration."
InterDigital's current M2M research includes an M2M services delivery platform, standards leadership with the European Telecommunications Standards Institute (ETSI), and other areas of research. Recently, InterDigital technology powered a nine-vendor demonstration of standards-based M2M technology at the 3rd ETSI TC M2M Workshop in Mandelieu, France. InterDigital's M2M technology has been integrated into the trial platforms of various market participants, including BUTLER, Intecs, Intel Corporation, Kontron, Mformation, Radisys, Sensinode, and others.
"We're honored to partner with Sony, a company that is synonymous with so many advances in consumer technology, and to contribute our expertise in core wireless research. InterDigital's research efforts in M2M are mature, and have from the start been focused on creating a standards-based framework to benefit all companies in the wireless space — operators, device makers and others. We believe that collaborating with Sony through Convida Wireless will bring those efforts to the next level," said William J. Merritt, President and CEO of InterDigital.
About InterDigital®
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and strategic relationships with many of the world's leading wireless companies. Founded in 1972, InterDigital is listed on NASDAQ and is included in the S&P MidCap 400® index. InterDigital is a registered trademark of InterDigital, Inc. For more information, visit: www.interdigital.com.
About Sony Corporation of America
Sony Corporation of America, based in New York, NY, is the U.S. subsidiary of Sony Corporation, headquartered in Tokyo, Japan. Sony Corporation is a leading manufacturer of audio, video, communications, and information technology products for the consumer and professional markets. Its motion picture, television, computer entertainment, music and online businesses make Sony one of the most comprehensive entertainment and technology companies in the world. Sony's principal U.S. businesses include Sony Electronics Inc., Sony Computer Entertainment America LLC, Sony Pictures Entertainment Inc., and Sony Music Entertainment. Sony recorded consolidated annual sales of approximately $79 billion for the fiscal year ended March 31, 2012, and it employs 162,700 people worldwide.
About Stephens Capital Partners LLC
Stephens Capital Partners LLC is the principal investing affiliate of Stephens Inc., a full service investment banking firm headquartered in Little Rock, Arkansas, which maintains offices in Conway, Hot Springs and Fayetteville, Arkansas and outside Arkansas in Atlanta, Austin, Baton Rouge, Boston, Charlotte, Chicago, Columbia, Dallas, Houston, Jackson, Memphis, Nashville, New Haven, New York City, Oklahoma City, Richmond, St. Petersburg, Washington, D.C. and London. For more information, please visit www.stephens.com
|
Related News
- STMicroelectronics and NXP unveil management team for joint venture
- TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
- Imagination Technologies and BAIC Capital announce automotive joint venture
- Fab Joint Venture Seen for 200 mm
- GLOBALFOUNDRIES and Chengdu Realign Joint Venture Strategy
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |