Cadence Receives TSMC's Customers' Choice Award
Award Honors Cadence Paper on DRAM IP and Technology
SAN JOSE, Calif., 24 Jan 2013 - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, received the “Customers’ Choice Award” for its paper on DRAM Interface IP and technology at TSMC’s recent Open Innovation Platform™ Ecosystem Forum. The paper focused on current and emerging trends in DRAM memories, and the technologies required to enable them. The award marks the second straight year attendees at the TSMC event selected Cadence® for the honor.
In its paper, Cadence demonstrated advanced capabilities in the areas of 3D-IC, hybrid memory cube (HMC), wide I/O and other important DRAM developments. The company highlighted its early development of test chips with TSMC for advanced process nodes and its early IP releases for the newest industry standards.
“The Customers’ Choice Award acknowledges the value of the contributions Cadence is making to bring new DRAM interface technology to market faster,” said Martin Lund, senior vice president, research and development, SoC Realization Group at Cadence. “Working closely with TSMC and our customers, we have developed the IP and technology that serves as a major enabler for early customer adoption of advanced technology.”
“Cadence is helping our customers bring their next-generation technology to market,” said Suk Lee, TSMC senior director of Design Infrastructure Marketing. “Innovation in important areas like memory interface IP can have a significant impact on our customers’ success, and this award is a reflection of that.”
A year earlier, attendees at the TSMC ecosystem forum recognized Cadence for its paper on using clock concurrent optimization to improve power, performance and area on ARM A9 Cortex cores.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- Cadence Recognized with TSMC OIP Ecosystem Forum Customers' Choice Award for 3D-IC Design
- Synopsys Receives Customers' Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum
- Open-Silicon Receives TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
- M31 Receives "Customers' Choice Award" from TSMC OIP Forum 2014
- Cadence Receives Two TSMC Customers' Choice Awards
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |