Intel says no LTE-processor integration until 2014
Peter Clarke, EETimes
1/28/2013 7:21 AM EST
LONDON – Intel is making progress with its development of LTE modems since but does not expect to have an integrated LTE modem and application processor until 2014, according to CEO Paul Otellini.
When asked specifically about integration of LTE modem circuitry with a mobile application processor such as the Atom during an analysts' conference call held to discuss Intel's fourth quarter 2012 financial results, Otellini said: "In terms of integrated solutions, you'll see higher levels of integration from us next year."
E-mail This Article | Printer-Friendly Page |
|
Related News
- Intel CEO says the ARM way is no way to make money
- No nanoelectronics technology can replace CMOS until 2030, says TI exec
- Intel says it has no plans to license Wireless MMX
- Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters
- Intel to place US$14 billion orders with TSMC, says report
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards