Globalfoundries commits to FDSOI process
Peter Clarke, EETimes
2/7/2013 4:34 AM EST
LONDON – Globalfoundries Inc. has set out a timetable to the high volume production of fully-depleted silicon-on-insulator (FDSOI) chips making the mainstream adoption of the process possible. Globalfoundries (Milpitas, Calif.) had previously signed a memorandum of understanding to manufacture the process with the developer, STMicroelectronics NV (Geneva, Switzerland).
Mike Noonen, executive vice president of worldwide marketing and sales at the foundry chip maker, told an audience at the Common Platform Technology Forum, held at the Santa Clara Convention Center, California, that a physical design kit for the process will be available in the first quarter of 2013.
E-mail This Article | Printer-Friendly Page |
|
Related News
- VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP Based on GLOBALFOUNDRIES 22FDX FD-SOI Process for IoT Applications
- GLOBALFOUNDRIES Announces Industry's Most Advanced Automotive-Qualified Production FD-SOI Process Technology
- Synopsys Design Platform Certified by GLOBALFOUNDRIES for 22nm FD-SOI Process Technology
- Synopsys Joins GLOBALFOUNDRIES' FDXcelerator Partner Program to Enable Innovative Designs Using the FD-SOI Process
- Globalfoundries Working on Next-Gen FDSOI Process
Breaking News
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition