English
Tensilica vs. Ceva in imaging/vision IP core battle
Junko Yoshida, EETimes
2/12/2013 5:01 AM EST
NEW YORK--Rapidly evolving imaging and embedded vision algorithms are opening up a new battleground for DSP core IP companies in the high-performance and power-efficient imaging needs of mobile handsets, automotive and video products.
Following Ceva’s introduction a year ago of MM3101, a programmable, low-power imaging and vision platform, Tensilica Tuesday (Feb. 12) rolled out an imaging and video dataplane processor unit (DPU), called IVP.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- MulticoreWare Inc. Becomes CEVA's Trusted Partner for Imaging & Computer Vision
- Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution
- Nextchip License CEVA Imaging and Vision Platform for ADAS Vision System
- Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices
- ON Semiconductor License CEVA Imaging and Vision Platform for Automotive ADAS
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards