First Silicon Solutions to Develop Instrumentation IP for Rockwell Collins
Rockwell Collins Selects First Silicon Solutions to Provide On-Chip Instrumentation IP and Tools for Avionics Hardware and Software Development
Portland, OR, May 15, 2002 -- First Silicon Solutions (FS2), a leading provider of silicon IP and custom development tools for SOC and SOPC designs, announced today that it has been selected to provide microprocessor instrumentation IP and tools for Rockwell Collins of Cedar Rapids, Iowa. The FS2 tools will be used by Rockwell Collins to develop and test software in existing high-reliability avionics system designs.
Rockwell Collins selection of FS2 will provide a long term upgrade path for its design teams as they transition products from existing traditional processors and tools to SOC based designs. FS2's Navigator® OCI® (on-chip instrumentation) blocks will provide powerful debug features and logic that are typically inaccessible using traditional desktop tools.
"Rockwell Collins chose us for this job after careful evaluation of our capabilities and our ability to respond quickly, delivering state-of-the-art tools on-time and on-target to match the design team's needs. By re-engineering the existing core design with the FS2 Navigator Suite of Tools, we will be able to leverage this custom IP to provide an easy upgrade path for Rockwell Collins more sophisticated designs well into the future."
About Rockwell Collins (NYSE: COL)
Rockwell Collins is a global company providing aviation electronics for the world's aircraft manufacturers and more than 400 airline customers, as well as a major share of the world's military forces. The company maintains headquarters and manufacturing operations in the United States in addition to locations in Europe, Australia and Mexico.
About First Silicon Solutions, Inc. - www.fs2.com
FS2, located in Portland, Oregon, provides custom OCI enabled IP and development tools in-silicon for testing and debug of microprocessor-based hardware and software to major developers worldwide. FS2 helps silicon vendors and their customers develop and more effectively market their products, reducing their development cycles, and allowing them to focus on delivering all the potential of the system on silicon. For additional information, contact Chuck Swartley at (503) 292-6730 x103.
|
Related News
- Efinix Partners with Samsung to Develop Quantum eFPGAs on 10nm Silicon Process
- eASIC and ASOCS Partner to Develop Custom Silicon Accelerators for Network Function Virtualization (NFV)-based Virtual Base Station Solutions
- EADS Astrium, Hifn, Innovision Research, Magnum Semiconductor, Rockwell Collins, Universite de Cergy Pontoise, Vivante, and Wipro Join OCP-IP
- Silicon Hive and Apical Imaging Partner to Develop World Class Embedded Imaging Solutions For Mobile Devices
- Freescale and TSMC to Develop Silicon-on-Insulator Technology
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |