How Conexant ended up filing for Chapter 11
Junko Yoshida, EETimes
3/5/2013 3:01 PM EST
Madison, Wis.--Both Broadcom Corp. and Conexant Systems Inc. deployed aggressive acquisition strategies in similar market segments starting in the late 1990’s—each company betting the farm on the burgeoning broadband market. In the end, they achieved spectacularly different results.
Broadcom (Irvine, Calif.), today armed with $8.01 billion in annual revenue, is the world’s second largest fabless chip company after Qualcomm Inc.. On the other hand, Conexant, who saw its revenue decline from $2.1 billion in 2000 to just $135 million in 2012, is fighting for survival.
E-mail This Article | Printer-Friendly Page |
Related News
- NXP Semiconductors Comments on Impact of Trident Microsystems Chapter 11 Filing Announces Conference Call to Review Fourth Quarter 2011 Financial Results
- Wave Goodbye, Hello MIPS as Chapter 11 Resolved
- Wave Computing Files for Chapter 11 Protection
- Wave Computing Set to File Chapter 11, With MIPS the Likely Winner
- Faraday Reports Second Quarter 2019 Financial Results 2Q19 Revenues NT$1.2 Billion, Up 11% QoQ
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards