China, India outspending U.S. in semiconductors
Rick Merritt, EETimes
3/19/2013 2:01 AM EDT
China and India will separately announce plans to invest billions in semiconductors this year, moves Cadence CEO Lip-Bu Tan says he wish the U.S. would make. SANTA CLARA, Calif. – The governments of China and India will each announce plans to pump billions of dollars into their semiconductor industries this year, said Lip-Bu Tan, the chief executive of Cadence Design Systems Inc. and a veteran investor, bemoaning the decline of U.S. venture capital funding for chips.
In a roundtable with tech journalists before his keynote at the annual CDN Live event here, Tan shared his opinions on the lack of startups, the rising cost of chip design and the need to reposition the EDA industry for growth.
“China and India are pouring money” into semiconductors and “the U.S. government should do the same,” said Tan. If it doesn’t, some day U.S. engineers “will have to go to China to work, and its painful to see your kids go to the other side of the world,” he said.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility
- U.S. Ban on Huawei Seen Widening China Chip War
- U.S. Chip Sanctions "Put Temporary Checkmate on China"
- New U.S. Rule Could "Impair" China's AI Progress
- U.S. Passes CHIPS Act, Increasing Restrictions on China Lead to Rising Geopolitical Risk, Says Trendforce
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset