Algotochip Becomes Tensilica Design Center Partner
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, Calif. – March 25, 2013 –Tensilica, Inc. today announced that Algotochip has joined its Xtensions™ partner network and will offer design services that incorporate Tensilica’s DPUs (dataplane processor units). Algotochip now has access to Tensilica’s technology to help it market and deploy innovative solutions that will enable developers to get their Tensilica-based products to market faster.
“The digital solution we provide are unique to the individual customer and completely owned by that customer,” said Didier Boivin, Algotochip’s vice president of marketing. “Once we receive the C-code and test-vectors to verify it, Algotochip does all the work involved in creating a complete digital solution including all the necessary software and firmware for the Tensilica DPUs. The customer doesn’t have to learn any new tools and can focus on the product specification and algorithms – realizing the digital solution through our relationship.”
Algotochip’s patented approach can speed hardware and software design for SOCs (systems on chip) in as little as eight weeks. Algotochip guarantees that its SOC meets all the performance specifications made by the customers, and insures that it will be right the first time.
“We are delighted to add Algotochip to our design center partner program,” stated Chris Jones, Tensilica’s director of product marketing. “They have extensive expertise in many areas of chip design and can help customers get their chips to market much faster.”
About Algotochip
Algotochip is the industry’s first company to provide complete SoC GDSII from Algorithms written in behavioral C-code in weeks versus years with conventional design approach. The company’s patented approach provides many direct benefits to the customer going from time to market to design cost to lower power through proprietary power aware architecture design. The company is privately held and based in Sunnyvale, California, U.S.A. For additional information, please visit http://www.algotochip.com.
About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP core licensing with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- Fraunhofer IIS Becomes Tensilica Authorized Design Center Partner
- Dream Chip Technology Becomes Tensilica System-on-Chip (SOC) Design Center Partner
- Wipro Becomes Tensilica Processor Core Design Center Partner
- Inomize Becomes TSMC Design Center Alliance Partner
- Inomize Becomes Newest Tensilica Design Center in Israel
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |