English
3-D integration takes spotlight at ISPD
R Colin Johnson, EETimes
3/26/2013 11:57 AM EDT
LAKE TAHOE, Nev.—Three-dimensional integration was the focus on the kickoff day for the annual International Symposium on Physical Systems (ISPD), where semiconductor designers worldwide show-off their next-generation aspirations for the physical design of future chips.
Keynoting the 3-D track was veteran chip architect Liam Madden, vice president of FPGA development at Xilinx Inc. (San Jose, Calif.) who claimed that chip designers can have their 3-D cake and eat it, too.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs
- Logic design optimization takes a quantum leap with Dolphin Integration's standard cell library enriched with pulsed latches
- Chip execs see 20 nm variants, 3-D ICs ahead
- 3-D FPGAs enable silicon convergence
- Tabula Confirms Move to Intel's 22nm Process Featuring 3-D Tri-Gate Transistors
Breaking News
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition