Global Semiconductor Sales Remain Ahead of 2012 Pace in February
Effective government policies needed to spur stronger growth
WASHINGTON, D.C.—April 1, 2013—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $23.25 billion for the month of February 2013, an increase of 1.4 percent from February 2012 when sales were $22.93 billion. Global sales from February 2013 were 3.8 percent lower than the January 2013 total of $24.17 billion, reflecting seasonal trends, but year-to-date sales through February 2013 were 2 percent higher than at the same point last year. All monthly sales numbers represent a three-month moving average.
“Despite persistent economic uncertainty, the global semiconductor industry is off to a promising start in 2013 – led by strength in memory sales – and is ahead of last year’s pace,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “To help spur stronger growth, Congress and the Administration should invest in basic research to boost American innovation, reform the high-skilled immigration system to welcome the top scientific minds from around the world, and modify the tax system so businesses can expand, invest and hire new workers.”
Regionally, year-over-year sales increased in Asia Pacific (6.7 percent) and the Americas (1.6 percent), but decreased in Europe (-1.5 percent) and Japan (-15.7 percent). Sales increased in Europe (1.4 percent) compared to the previous month, but decreased in Asia Pacific (-3.6 percent), Japan (-5 percent) and the Americas (-6.2 percent).


|
Related News
- Mid-Year Global Semiconductor Sales Ahead of Last Year's Pace by 4 Percent
- Global Semiconductor Sales Increase in October, Remain Above Seasonal Rate
- Global Semiconductor Sales Remain Flat in August
- Global Semiconductor Sales Remain Steady in June
- Global Semiconductor Sales Increase in May, Remain on Track for Modest Growth in 2012
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |