Process Detector (For DVFS and monitoring process variation)
Altera Expands OTN Solution Capabilities with Acquisition of TPACK
April 15, 2013 -- Altera Corporation (NASDAQ: ALTR) today announced it has agreed to acquire TPACK, a wholly-owned subsidiary of Applied Micro Circuits Corporation (NASDAQ:AMCC). TPACK delivers complete FPGA-based OTN (optical transport network) products targeting packet and optical networking equipment suppliers. The acquisition enables Altera to accelerate and expand its OTN solutions roadmapto support the increasing pipeline of customer designs resulting from Altera’s successful acquisition in 2010 of Avalon Microelectronics, a leading OTN IP provider. Combining TPACK with Altera’s current OTN development team positions Altera for continued growth in FPGA-based IP solutions for the OTN equipment market, which is forecast to reach $13B by 2017, according to research firm Infonetics.
TPACK develops OTN solutions in the form of SoftSilicon® technology to provide mapping, multiplexing and cross-connection of packets over an OTN network and pioneered standard chipset solutions similar to ASSPs, yet targeting FPGAs. SoftSilicon products are available today on Altera FPGAs and have been in production for years. TPACK products have successfully displaced ASSPs at leading OEMs at 10-Gbps, 40-Gbps and 100-Gbps. The acquisition of TPACK bolsters Altera’s portfolio of OTN solutions, including cost-optimized 20-Gbps OTN mappers for Metro applications and 10 x 10 Gbps OTN Cross-Connect using partial reconfiguration for Packet-Optical Transport Systems.
"Altera has been collaborating with TPACK on joint marketing and development since 2007,”said Scott Bibaud, senior vice president and general manager, Communications and Broadcast Division, Altera. “The combined capabilities of TPACK and Altera accelerate our OTN solutions roadmap to support emerging applications beyond 100G. TPACK’s recent demonstration of partial reconfiguration on Altera Stratix V devices validates the advantages of programmable technology for high-density OTN applications requiring multiple client interfaces.”
Altera is leading the OTN industry’s evolution beyond 100G by delivering flexible solutions not possible in ASSPs with increased levels of performance and integration. Adding the TPACK technology and team of engineers will allow Altera to rapidly provide customers with flexible, scalable solutions in a fast-growing market with changing protocols and evolving standards. TPACK is located in Copenhagen, Denmark.
About Altera
Altera® programmable solutions enable system and semiconductor companies to rapidly and cost effectively innovate, differentiate and win in their markets. Find out more about Altera's FPGAs, SoCs, CPLDs and ASICs at www.altera.com.
|
Altera Hot IP
Related News
- Arm Expands IoT Connectivity and Device Management Capabilities with Stream Technologies Acquisition
- Altera Expands Its OTN Portfolio with a Single-Chip 100G Muxponder Solution
- Acquisition of Intrinsix Corp.'s Federal Systems Division Expands Abraxas Corporation's Engineering Capabilities
- BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform
- Altair Signs Agreement to Acquire Metrics Design Automation Inc. Expands Footprint in EDA Industry
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |