English
Cheap smartphone boom bodes ill for Intel
Rick Merritt, EETimes
4/17/2013 1:00 PM EDT
SAN JOSE, Calif. – The keys to success for the next round of smartphone processors will be integration and low cost, and Intel is not well poised for the battle, according to a keynote address from a veteran market watcher.
The market for handsets selling for more than $350 will grow just six percent while the market for sub-$350 smartphones will expand at a roaring 69 percent, predicted Linley Gwennap, principal analyst of The Linley Group (Mountain View, Calif.) at an annual mobile event here.
In a related trend, the share of handsets using applications processors with integrated basebands will expand from 50 to 72 percent from 2012 to 2016. Meanwhile, the market for standalone apps processors will fall from 30 to 14 percent over that period, with many of the devices made by Samsung.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Intel Completes Sale of Smartphone Modem Business to Apple
- Intel to Exit 5G Smartphone Modem Business, Focus 5G Efforts on Network Infrastructure and Other Data-Centric Opportunities
- How Intel Missed the Smartphone Call
- Intel and ARM Entering a Price War?
- Intel Targets Fast-Growing, Low-End Smartphone Market with New Atom Processor Platform
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards