DMP 3D Graphics IP Core "SMAPH-S" is selected by Renesas Electronics
Tokyo, Japan, April 23 2013 – Digital Media Professionals Inc. (DMP), a leading provider of 2D/3D graphics IP (Intellectual Property) cores, announced today that Renesas Electronics, a premier supplier of advanced semiconductor solutions, has selected DMP 3D graphics IP core “SMAPH-S”.
SMAPH-S, which supports OpenGL ES® 3.0/2.0, is designed to deliver the best performance at the smallest area while minimizing power consumption. SMAPH-S supports a wide range of product applications from mobile devices such as smartphone and tablet, to multi-function printers, smart TV etc, using a variety of operating systems including Android, Linux, Windows, VxWorks and micro-ITRON. Its small area and low power consumption help to enhance product competitiveness of its adopters.
“We are honored to license SMAPH-S to Renesas Electronics. The requirement for rich graphics expression is growing rapidly, and graphics IP core performance is one of the key factors for recent devices. It is very satisfying for us to have our high performance, small area size and low power consumption recognized by a leading provider like Renesas Electronics.” – Tatsuo Yamamoto, CEO, DMP.
About DMP
Digital Media Professionals Inc. (TOKYO: 3652) develops industry leading 2D and 3D graphics solutions for global consumer electronics, mobile, embedded and automotive markets. The company was founded in Tokyo, Japan in 2002 and is currently developing several graphics IP cores based on the Khronos™ Group open standards and DMP’s cutting edge 3D graphics IP “Maestro Technology”
|
DMP Inc. Hot IP
Related News
- DMP licenses GPU IP core "SMAPH-F" for Renesas Electronics' SoCs for Office Appliances
- DMP 3D Graphics IP Core "PICA200 Lite" is adopted for OLYMPUS PEN Lite E-PL5.OLYMPUS PEN mini E-PM2
- DMP SMAPH-S Products to Support OpenGL ES 3.0 API Standard
- DMP 3D Graphics IP Core "PICA200 Lite" is adopted for OLYMPUS Tough TG-1
- TES Electronic Solutions Selected By NEC Electronics for 3D Embedded Graphics Technology
Breaking News
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
- intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
- TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
- Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
Most Popular
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+
- 创飞芯宣布其反熔丝一次性可编程(OTP)技术在90nm BCD 工艺上实现量产
- Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Mixel Announces the Opening of New Branch in Da Nang, Vietnam
E-mail This Article | Printer-Friendly Page |