Teledyne Acquires Axiom IC
THOUSAND OAKS, Calif. – May 14, 2013 – Teledyne Technologies Incorporated (NYSE:TDY) announced today that its subsidiary, Teledyne DALSA B.V., has acquired Axiom IC B.V., a fabless semiconductor company that develops high-performance CMOS mixed-signal integrated circuits. Terms of the transaction were not disclosed.
Located in Enschede, the Netherlands, Axiom IC was founded in 2007 and is a spin-off from the University of Twente. Axiom IC’s customers include global companies in a number of industries, including space systems, wireless communications, automotive and medical technologies. Axiom has delivered important design breakthroughs including high speed, high resolution analog to digital converters and advanced audio signal processing chips.
“The acquisition of Axiom adds an innovative team of skilled engineers to Teledyne,” said Robert Mehrabian, chairman, president and chief executive officer of Teledyne. “While continuing to serve external customers, Axiom will provide additional resources to benefit both our digital imaging and electronic test & measurement instrumentation businesses.”
“The Axiom team will further enhance our ability to bring to our customers innovative and highly differentiated CMOS-based image sensor and camera products,” said Brian Doody, chief executive officer of Teledyne DALSA, Inc. “Axiom’s unique mixed-signal design expertise and experience represent a valuable strengthening of our design capabilities across the company, complementing our existing expertise in CMOS image sensor design, high voltage driver chips for MEMS, and embedded software development.”
About Teledyne Technologies
Teledyne Technologies is a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems. Teledyne Technologies’ operations are primarily located in the United States, Canada, the United Kingdom and Mexico. For more information, visit Teledyne Technologies’ website at www.teledyne.com.
About Teledyne DALSA
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing MEMS products and services. For more information, visit www.teledynedalsa.com.
|
Axiom IC Hot IP
Related News
- Siemens acquires proFPGA product family from PRO DESIGN to expand industry-leading IC verification portfolio
- Siemens acquires Austemper Design Systems for breakthrough IC functional safety technology
- NXP Semiconductors Acquires Wearable and Bluetooth Low Energy IC Business of Quintic
- Cadence Acquires Sigrity, a Leader in High-Speed PCB and IC Packaging Analysis
- Rapid Bridge Acquires QThink IC Design
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |