Samsung Announces Industry-First 45 nanometer Embedded Flash Logic Process Development
SEOUL, South Korea -- May 16, 2013 -- Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, today announced the industry's first 45 nanometer (nm) embedded flash ("eFlash") logic process development. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.
"Samsung's 45nm eFlash logic process has the potential to be broadly adopted into various components for security solutions and mobile devices, including smart card IC, NFC IC, eSE (embedded secure element) and TPM (Trusted platform module)," said Taehoon Kim, vice president of marketing, System LSI Business, Samsung Electronics. "The excellent performance from this smart card test chip will help solidify our leadership in the security IC market."
The smart card IC based on Samsung's 45nm eFlash logic process guarantees high reliability and endurance of 1 million cycles per flash memory cell. The performance results are the industry's best class and superior to any other solutions currently on the market, generally rated for 500,000 cycles.
Through the improvement in both flash cell structure and operating scheme, the test chip features random access time to read memory that is 50 percent faster and the power efficiency is enhanced by 25 percent over previous products built on the 80nm eFlash logic process.
Samsung's advanced 45nm eFlash logic technology, built on the technological synergies created through decades of know-how and experience in both embedded flash and logic processes, will enable Samsung to provide competitive performance levels and greater value to its foundry and ASIC customers in the field of consumer microcontrollers and automotive chips that require higher speed, larger memory capacity and higher power efficiency.
Initial smart card IC samples for commercialization using this 45nm eFlash logic technology are expected to be available in the second half of 2014.
About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. is a global leader in technology, opening new possibilities for people everywhere. Through relentless innovation and discovery, we are transforming the worlds of televisions, smartphones, personal computers, printers, cameras, home appliances, LTE systems, medical devices, semiconductors and LED solutions. We employ 236,000 people across 79 countries with annual sales of US$187.8 billion. To discover more, please visit www.samsung.com.
|
Related News
- Virage Logic Named as TSMC's 45-Nanometer Process Early Development IP Partner
- Toshiba Launches ARM Cortex-M3-based Microcontrollers with Latest 65nm Flash Embedded Logic Process for Motor Control and Consumer Devices
- Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology
- STMicroelectronics Announces World's First 55 Nanometer Embedded Flash Process Technology for Automotive Microcontrollers
- Samsung and Intrinsity Jointly Develop the World's Fastest ARM Cortex-A8 Processor Based Mobile Core in 45 Nanometer Low Power Process
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |