North American Semiconductor Equipment Industry Posts April 2013 Book-to-Bill Ratio of 1.08
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08, according to the April EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.
The three-month average of worldwide bookings in April 2013 was $1.17 billion. The bookings figure is 6.4 percent higher than the final March 2013 level of $1.10 billion, and is 26.8 percent lower than the April 2012 order level of $1.60 billion.
The three-month average of worldwide billings in April 2013 was $1.08 billion. The billings figure is 9.3 percent higher than the final March 2013 level of $991.0 million, and is 25.7 percent lower than the April 2012 billings level of $1.46 billion.
“Both bookings and billings trends have been improving over the last four months, with the book-to-bill ratio remaining above parity over the same period," said Denny McGuirk, president and CEO of SEMI. “While orders remain well below last year’s numbers, the current order and spending activity is aligned with 2012 capex plans.”
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.
| Billings | Bookings | Book-to-Bill |
November 2012 | 910.1 | 718.6 | 0.79 |
December 2012 | 1,006.1 | 927.4 | 0.92 |
January 2013 | 968.0 | 1,076.0 | 1.11 |
February 2013 | 974.7 | 1,073.5 | 1.10 |
March 2013 (final) | 991.0 | 1,103.3 | 1.11 |
April 2013 (prelim) | 1,083.2 | 1,173.4 | 1.08 |
Source: SEMI, May 2013
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the Equipment Market Data Subscription (EMDS).
SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
|
Related News
- North American Semiconductor Equipment Industry Posts May 2013 Book-to-Bill Ratio of 1.08
- North American Semiconductor Equipment Industry Posts April 2016 Book-to-Bill Ratio of 1.10
- North American Semiconductor Equipment Industry Posts April 2015 Book-to-Bill Ratio of 1.04
- North American Semiconductor Equipment Industry Posts December 2013 Book-to-Bill Ratio of 1.02
- North American Semiconductor Equipment Industry Posts November 2013 Book-to-Bill Ratio of 1.11
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |