ProximusDA teams with STMicroelectronics to develop next-generation distributed SOC TLM virtual prototypes
Munich -- May 23, 2013 -- ProximusDA GmbH, a company based in Munich, Germany, today announced its joint efforts with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, to develop the next generation of software virtual prototypes. The collaboration combines ProximusDA’s expertise in parallel code distribution with STMicroelectronics’ deep knowledge of Transaction Level Modeling (TLM) and advanced distributed-computing architecture.
ProximusDA has developed a technology to enable the distribution and execution of complex distributed applications over multi-core CPUs and GPUs. The foundation of this technology relies on a formal and explicit system-level communication modeling at the transaction level throughout the complete system. ProximusRealizer, a ProximusDA product announced last year at DAC in San Francisco, leverages its distributed execution kernel to support critical SOC design tasks:
- Capturing and executing SOC functional specifications (HW independent system level specs).
- System level hardware & software architecture explorations and specifications.
- Embedded software development, mapping and distributed execution & profiling.
- System-level HW verification and SW validation.
ProximusRealizer builds high-performance distributed software virtual prototypes (SVP) by leveraging multi-cpu/multi-core hardware available in today's off-the-shelf servers. It enables HW & SW architects to explore multiple HW/SW trade-offs in a fraction of time that it would take with a traditional SystemC (OSCI) TLM and earlier than with FPGA approaches.
“Our collaboration with ST demonstrates the beneficial synergy between ProximusDA and its customers. By combining ProximusDA’s expertise in parallel and distributed software application with ST’s deep expertise in SOC advanced distributed-computing architecture and its undisputed SystemC TLM leadership, we are able to deliver solutions that uniquely address the requirement and complexity of upcoming SOC products. The first achievement of the collaboration has been to allow ST to build distributed execution runtime of its SystemC TLM platforms on machines with up to 64 cores, said Enno Wein, CEO of ProximusDA.
The next generation of System-on-a-Chip (SOC) requires critical attention to the development of the embedded software due to the intrinsic nature of the distributed computing architecture. At the same time, the design of heterogeneous multi-core architectures is demanding massive computing resources to fuel software virtual prototypes.
“ST has a strong focus on the embedded processing segment as the heart of electronics systems, so we wanted to move our TLM virtual prototyping to the next level of performance in order to stay ahead of the competition, said Laurent Ducousso, Virtual Platform Manager, Unified Platform Division R & D, Digital Convergence Group, STMicroelectronics. “Working with ProximusDA leverages our in-depth SystemC TLM investment and enables accelerated execution speed. With excellent performance results, we are currently integrating ProximusDA technologies into our TLM environment.”
Availability and Compatibility :
ProximusRealizer is currently available in production.
About ProximusDA :
ProximusDA GmbH is headquartered in Munich, Germany, and has a wholly owned subsidiary in Yerevan, the capital of Armenia. Research, product definition, marketing, business development and sales as well as overall administration are located in the German headquarter. ProximusDA is a spin-off from Instigate CJSC, headquartered in Yerevan, Armenia based on technology developed by Instigate since 2005. The technology is based on about 200 man years of experience in the design of massive parallel systems at Instigate since 2005
|
Related News
- CoWare Virtual Platform Product Family Adopted by Fujitsu For Completing Their Next-Generation SoC Design Flow
- STMicroelectronics and Synopsys Partner to Develop Next-Generation, C-Based System Level Design Solution for Complex Systems on a Chip
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
- ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
- Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |