With BassPower for headphones, Dolphin Integration eliminates up to 80% of external capacitor cost
Grenoble, France – June 14, 2013 -- Adequate IP procurement may serve well for cost reduction on the Bill of Material. For portable devices, such as Smartphones and Tablets, the race to the reduction of device thickness adds constraints on PCB area and package thickness. Dolphin Integration blows it all by providing Audio Codecs with their new BassPowerTM headphone feature. This innovation has been implemented in response to economical market constraints, thanks to its very low silicon area enabling a significant cost reduction of the Bill of Material.
For mastering this application challenge and dealing with TRRS phone connectors (Left/Right output with microphone input) - mandatory in hands-free set applications -, Dolphin now provides two different solutions:
- A True-ground headphone driver, the best solution whenever triple-well option is already used by other part of the SoC.
- The BassPowerTM solution, maintaining cost down by using standard CMOS processes. BassPowerTM enables reducing the capacitor value from 220 uF down to 10 uF!
A flexible solution
BassPowerTM is also provided with three pre-defined settings (Ultra-linear, Bass Attack preserved, Max volume) for adjusting the BassPowerTM flavor.
The high configurability of bass compensation over frequencies allows to support a large set of application schematics, enabling the user to define the best trade-off between Bill-of-Material and maximum output power delivered to the headphone. Furthermore, BassPowerTM remains the same from one audio source to another whatever the sampling frequency, in contrast to DSP solutions which need to readjust their settings.
Consequently, BassPowerTM enables a cost-effective solution for smartphone and tablet applications and preserves the quality of audio experience.
Audio converter portfolio:
- Proven 24-bit sigma-delta Audio Codec from 180 nm to 40 nm available in major foundries
- Up to 100 dB of SNR
- THD: -80 dB for the line-in to ADC path
- < 8.0 mW of power consumption for DAC playback mode at 2.5V
Please, click here for more information about our Audio Converter catalogue, or/and contact our Marketing Manager at jazz.audio@dolphin.fr
About Dolphin Integration
Dolphin Integration contribute to "enabling mixed signal Systems-on-Chip". Their focus is to supply worldwide customers with fault-free, high-yield and reliable kits of CMOS Virtual Components of Silicon IP, based on innovative libraries of standard cells, flexible registers and low-power memories. They provide high-resolution converters for audio and measurement, regulators for efficient power supply networks, application optimized micro-controllers.
They put emphasis on resilience to noise and drastic reductions of power-consumption at system level, thanks to their own EDA solutions missing on the market for Application Hardware Modeling as well as early Power and Noise assessment. Such diverse experience in ASIC/SoC design and fabrication, plus privileged foundry portal even for small or medium volumes, makes them a genuine one-stop shop covering all customers’ needs for specific requests.
|
Dolphin Design Hot IP
Related News
- Dolphin Integration reduces silicon area by 40 % on its new audio codecs targeting wireless devices
- Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA
- Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70%
- Save up to 20 % of silicon area with Dolphin Integration's standard cell library SESAME uHD
- Dolphin Integration unveils extremely dense audio CODECs for application processors at 28 nm and 16 nm
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |