Cirrus signs foundry deal with Hynix in move to expand IC outsourcing
Cirrus signs foundry deal with Hynix in move to expand IC outsourcing
By Semiconductor Business News
May 24, 2002 (12:00 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020524S0059
FREMONT, Calif. -- Cirrus Logic Inc. here today expanded its roster of silicon foundry providers, announcing a deal with South Korea's Hynix Semiconductor Inc. Cirrus signed a multi-year, renewable agreement establishing Hynix as a volume supplier of CMOS-based chip manufacturing services. Fremont-based Cirrus will have access to Hynix's portfolio of mixed-signal technologies. "Hynix's cost-conscious business model and advanced manufacturing services will help Cirrus Logic expand its leadership position in the digital entertainment revolution," said David Aldredge, vice president of fabrication operations at Cirrus. Cirrus also has arrangements with other foundry providers. The company has signed deals with Singapore's Chartered Semiconductor Manufacturing Pte. Ltd., China's Central Semiconductor Manufacturing Co. Ltd. and Taiwan's United Microelectronics Corp
Related News
- SST and SK hynix system ic Partner to Expand Availability of Embedded SuperFlash Technology
- Apple, TSMC to expand foundry ties
- Hynix Standardizes on SpringSoft's Verification Enhancement and Custom IC Design Solutions
- India's Wipro expands IC-design services by striking foundry deal with UMC
- Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |