Micron Tells Story of Building DRAM Cube
Rick Merritt, EETimes
8/13/2013 08:03 PM EDT
SAN JOSE, Calif. — Micron's Hybrid Memory Cube -- a 4 GByte stack of DRAM die on a 160 GByte/second interface now sampling to a few close partners -- almost didn't happen. The first prototype failed to make connections between the DRAM stack and a controller inside the package, forcing an all-hands-on-deck effort to save the project.
Two top engineering managers leading the program told some of the story behind the Cube in an interview with EE Times. They also shared a few of their goals for the next-generation chip now in the works -- an 8 GByte stack transferring data at up to 320 GBytes/second with even greater power efficiency that the current samples.
The Cube got its start in early 2006 when the industry was buzzing with talk both about multicore processors and 3D chip stacks using through silicon vias (TSVs).
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Micron Fab Incident Disrupts DRAM Supply
- Synopsys Delivers Next-Generation Verification IP for Micron's Hybrid Memory Cube Architecture
- Micron Technology Ships First Samples of Hybrid Memory Cube
- Altera and Micron Lead Industry with FPGA and Hybrid Memory Cube Interoperability
- Micron Announces Its First Fully Functional DDR4 DRAM Module
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation