Cadence Palladium XP Platform Chosen by Mellanox Technologies to Shorten Development Time of Interconnect Products
Cadence Palladium XP Platform Enables Mellanox to Accelerate System Integration by Effectively Accelerating Hardware and Software Integration
SAN JOSE, Calif. -- Aug 29, 2013 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Mellanox Technologies, a leading supplier of high-performance, end-to-end interconnect solutions for data center servers and storage systems, has selected the Cadence® Palladium® XP Verification Computing Platform for the development of its leading-edge server and storage products. By allowing hardware and software system integration prior to silicon availability, the Palladium XP platform improved the time to market for Mellanox by three months.
“Mellanox chose Cadence’s Palladium XP platform with PCI Express 3.0 and Ethernet SpeedBridge® solutions to effectively accelerate our hardware and software integration while improving quality and performance metrics,” said Roni Ashuri, senior vice president of engineering at Mellanox. “With the Palladium XP platform, we were able to speed up deployment of our interconnect products and achieve faster time to market.”
“Mellanox is an important new Palladium XP platform customer for Cadence, and we are collaborating with its design team on the development and verification of their ASICs and SoCs,” said Christopher Tice, corporate vice president, Hardware System Verification, System and Verification Group. “The market-leading FullVision debug technology in the Palladium solution dramatically enhances customers’ ability to both increase verification productivity and accelerate time to market. The ability to integrate hardware and software and to debug at speed is one of the reasons companies like Mellanox are consistently turning to the Palladium XP platform.”
The cornerstone of the Cadence System Development Suite, the Palladium XP platform is the industry’s first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. With its hot-swap technology with the Cadence Incisive® platform, the Palladium XP platform delivers unparalleled productivity as users can transition among simulation, simulation acceleration and emulation environments at runtime without re-compilation. The Palladium XP platform offers systems and semiconductor companies flexible new use models that accelerate verification and hardware-software integration, helping to assure on-time delivery of high-quality products to the market.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
|
Cadence Hot IP
Related News
- Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market
- Altair Semiconductor Adopts Cadence Palladium XP Platform for Advanced IoT SoC Development
- DMP Adopts Cadence Palladium XP Platform to Accelerate High Performance Graphic IP Core Development
- ARM Achieves 50X Faster OS Boot-Up on Mali GPU Development using Cadence Palladium XP Platform with ARM Fast Models
- CSR Selects Cadence Palladium XP Platform for Development of ARM-based Automotive Infotainment Systems
Breaking News
- Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
- Quadric Announces Lee Vick is New VP Worldwide Sales
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |