MIPI Alliance Defines Analog Reference Interface for Envelope Tracking
PISCATAWAY, N.J.-- September 18, 2013 --The MIPI® Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announces the availability of its Analog Reference Interface for Envelope Tracking (eTrak) specification. eTrak is a multi-source vendor, independent interface that provides interoperability between multiple 3G/4G modem chipsets and Envelope Tracking Power Supplies (ETPS), enabling wide deployment of envelope tracking technology. By integrating eTrak into RF modem chipsets and ETPS, the specification allows modem ICs to control the supply voltage of RF power amplifiers, which improves the efficiency of the transmitter, one of the three large power consuming elements in a mobile device. Previous fixed proprietary alternatives did not allow manufacturers the benefits of an industry standard solution including improved efficiency and lower costs.
“MIPI’s eTrak specification benefits any 3G or 4G mobile device – cell phones, tablets, data cards, to name a few. We do expect the greatest benefit of envelope tracking to be in lowering power consumption and improving battery life for high data rates communications like LTE and LTE-Advanced,” said Joel Huloux, Board Chairman of MIPI Alliance. “We are already seeing modem vendors and ETPS vendors incorporating the specification into their products to ensure compatibility. OEMS have also expressed excitement for eTrak as well because it gives them flexibility in selecting components for their products and platforms.”
eTrak is unique in that unlike other MIPI specifications, it provides a full analog interface, not just a PHY. The eTrak specification, as with all MIPI Alliance specifications, is available for members to download from the MIPI Alliance website. eTrak is available under MIPI Alliance IP rules, which are considered by the mobile industry to be adopter-friendly and well-respected.
About MIPI
MIPI® Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. Founded in 2003, the organization has more than 240 member companies worldwide, 12 active working groups and has delivered more than 30 specifications within the mobile ecosystem in the last decade. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, test and test equipment companies, as well as camera, tablet and laptop manufacturers. For more information, please visit www.mipi.org.
|
Related News
- MIPI Alliance Targets Mobile Analog Control Interfaces with New Working Group
- MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures
- MIPI Alliance Releases A-PHY v1.1, Doubling Maximum Data Rate and Adding New Implementation Options to Automotive SerDes Interface
- MIPI Alliance Completes Development of A-PHY v1.1, Doubling Maximum Data Rate and Adding New Options to Automotive SerDes Interface
- MIPI D-PHY v3.0 Doubles Data Rate of Physical Layer Interface While Extending Power Efficiency
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |