Cadence Receives Three TSMC Partner of the Year Awards for Design IP, 16nm FinFET and 3D-IC Solutions
SAN JOSE, Calif. -- October 1, 2013 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today received three TSMC Partner of the Year Awards during TSMC’s Open Innovation Platform forum – accepting the most awards from the event. Cadence was presented awards for three different categories including awards for analog/mixed signal IP, 16nm FinFET design infrastructure, and 3D-IC design solutions. The awards underscore the deep collaboration between the two companies in bringing the highest quality design capabilities to IC designers around the world.
Cadence received an award for the “Analog/Mixed-Signal IP” category. The winners of the IP award are chosen based on customer feedback, TSMC9000 compliance, number of tapeouts, wafer volume and support. Cadence has a mature and broad offering of analog/mixed-signal IP including 28nm IP designs.
The award for “Joint Development of 16nm FinFET Design Infrastructure” is a validation of a long-standing relationship between Cadence and TSMC, working together on advanced node technology development and specifically FinFET enablement. The “Joint Delivery of 3D-IC Design Solution” award is in recognition of the joint collaboration on the new 3D-IC reference flow, and TSMC’s first innovative, true 3D stacking 3D-IC testchip tapeout.
“The awards Cadence received were based on the quality results that were delivered for IP, 16nm FinFET and 3D-IC solutions,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing. “We look forward to continuing our partnership and delivering innovative design solutions to our mutual customers in the years to come.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
|
Cadence Hot IP
Related News
- Cadence Receives Two TSMC Partner of the Year Awards for 10nm FinFET Solutions and Analog/Mixed-Signal IP
- Siemens receives three 2021 TSMC OIP Partner of the Year awards for next-generation design enablement
- Cadence Recognized with Three TSMC Partner of the Year Awards
- TSMC Awards Synopsys "Partner of the Year 2013" for Joint Development of 16-nm FinFET Design Infrastructure
- Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |