CEVA, Inc. Announces Preliminary Third Quarter 2013 Revenues
MOUNTAIN VIEW, Calif. -- Oct. 3, 2013 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the mobile, digital home and networking markets, today announced preliminary revenues for the third quarter ended September 30, 2013. The company expects to report total revenues of approximately $10 million, as compared to the company's prior guidance of $11.5 million to $12.5 million.
"Our licensing and related revenues came in lower than projected for the third quarter due mainly to not closing a significant license agreement," noted Gideon Wertheizer, Chief Executive Officer of CEVA. "Beyond this licensing agreement, we continue to expand our licensee base and market reach beyond our core market, the cellular handset. During the third quarter, we signed four new, first-time CEVA customers for non-baseband applications for smart meters, satellite communication, automotive and connectivity. We also signed a follow-on agreement with a key player in the wireless infrastructure space."
Third quarter operating expenses is forecasted to be higher by approximately $600,000 than previously guided, due to a delay in receiving research and development grant payments from the Office of the Chief Scientist of Israel which were not received in the third quarter, as had been forecasted. However, these grants are expected to be received in the fourth quarter.
CEVA will issue its earnings results for the third quarter on October 30th, before the NASDAQ market opens.
Following the earnings release on October 30th, CEVA management will conduct a conference call at 8:30 a.m. Eastern Time to discuss the company's operating performance for the quarter.
The conference call will be available via the following dial in numbers:
- U.S. Participants: Dial 1-877-870-4263 (Access Code: CEVA)
- International Participants: Dial +1-412-317-0790 (Access Code: CEVA)
The conference call will also be available live via the Internet at the following link: http://www.videonewswire.com/event.asp?id=96235. Please go to the web site at least fifteen minutes prior to the call to register, download and install any necessary audio software.
For those who cannot access the live broadcast, a replay will be available by dialing +1-877-344-7529 or +1-412-317-0088 (access code: 10034620) from one hour after the end of the call until 9:00 a.m. (Eastern Time) on November 7, 2013. The replay will also be available at CEVA's web site www.ceva-dsp.com.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in more than 1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
|
Ceva, Inc. Hot IP
Related News
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |