Cadence Introduces Spectre XPS, A New FastSPICE Simulator Delivering Up To 10X Faster Throughput
BANGALORE, India -- Oct 9, 2013 -- At CDNLive India 2013, Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced Spectre® XPS (eXtensive Partitioning Simulator), a high-performance FastSPICE simulator that enables faster and more comprehensive simulation for large, complex chip designs. The new simulator delivers ground-breaking partitioning technology that brings up to 10X faster throughput compared to competitive offerings, shortening simulation from weeks to days. Spectre XPS uniquely enables designers to accurately measure timing while including the impact of IR drop, making it ideal for advanced-node, low-power mobile designs, where high performance, accuracy and a greater capacity for post-layout verification are imperatives.
Additional information about the new technology can be seen here.
Built on the leading Cadence® Spectre simulation platform, Spectre XPS allows the easy re-use of models, stimulus, analysis and overall methodology, thereby reducing support costs while improving time to production. The unified Spectre simulation platform spans SPICE, advanced SPICE, RF and FastSPICE, enabling easy transition across analysis and flows; Spectre XPS integrates into the Virtuoso® Analog Design Environment for mixed-signal design, and into the Liberate MX memory characterization tool for SRAM memory characterization.
The faster throughput of Spectre XPS lets design teams conduct more thorough and accurate simulations for large memory-intensive designs, as well as low-power architectures that require greater visibility into parasitics. In addition to improvements in throughput, the new simulator requires two to three times less system memory than competitive offerings, improving compute resources utilization.
“With the order of magnitude performance improvement of Spectre XPS, we are able to meet required turnaround time and quality-of-results goals,” said Suravi Bhowmik, manager, MCU Backplane, Embedded Processing, Texas Instruments Incorporated. “Our production rollout of Spectre XPS has enabled us to deliver accurate leakage and dynamic power results on complex low-power designs.”
“As designs continue to grow in complexity and size, new simulation technologies are needed to address such issues as the timing impact of IR drop and power gating,” said Tom Beckley, senior vice president, Custom IC and PCB Group. “The Spectre XPS FastSPICE simulator addresses these new challenges through next generation algorithms that deliver the simulation accuracy and performance required to reduce the risks of developing cutting-edge differentiated designs.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
|
Cadence Hot IP
Related News
- Cadence Introduces the Spectre X Simulator, a Massively Parallel Circuit Simulator Delivering Up to 10X Faster Simulation with the Same Golden Accuracy
- Cadence Introduces the Spectre FX FastSPICE Simulator Delivering up to 3X Performance Gains with Superior Accuracy
- Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator
- Cadence Introduces Genus Synthesis Solution, Delivering Up to 10X Improvement in RTL Design Productivity
- Cadence Introduces Innovus Implementation System, Delivering Best-in-Class Results with Up to 10X Reduction in Turnaround Time
Breaking News
- Alphawave Semi Audited Results for the Year Ended 31 December 2024
- BrainChip Gives the Edge to Search and Rescue Operations
- Shifting Sands in Silicon by Global Supply Chains
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- Equal1 advances scalable quantum computing with CMOS-compatible silicon spin qubit technology
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Intel Announces Strategic Investment by Silver Lake in Altera
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- AMD Achieves First TSMC N2 Product Silicon Milestone
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |