Cadence Showcases IP for Mobile, Home Entertainment and Automotive Markets at CES 2014
SAN JOSE, Calif. -- Dec 24, 2013 -- Cadence Design Systems, Inc. (NASDAQ:CDNS) plans to showcase its IP (intellectual property) that helps chip designers quickly integrate next-generation technology in new consumer devices at the 2014 International Consumer Electronics Show (CES). Visitors can make appointments to see the Tensilica® demonstrations, meet with Cadence executives, and discuss design challenges.
The following products containing Cadence Tensilica IP are scheduled for demonstrations at the show:
- Voice Activation, Command Set, Voice Biometrics, and Speaker Authentication
Cadence plans to demonstrate Sensory’s TrulyHandsfree™ 3.0 technology for voice activation, which enables personalization of the user experience by calling up a specific user’s history, preferences and settings. Sensory’s speaker verification technology uses voice biometrics and analysis to authenticate a specific individual. Sensory’s TrulyHandsfree complete set of voice activation and recognition products allow users to access a device with just their voice, bypassing the typical four-digit number manually entered on the screen for access. - Noise Reduction/Echo Cancellation and Beam Forming
The demo of Fortemedia iS600 voice pre-processing is scheduled to showcase acoustic echo cancellation (AEC), beam forming and noise reduction. - Waves MaxxAudio® Audio Post-Processing for Sound Enhancement
The MaxxAudio demo incorporates a host of proprietary signal-processing technologies to deliver dynamic and immersive sound from the small speakers typically found in many consumer electronics products. - Kronoton HDSX® Audio Post-Processing for Sound Enhancement in Automotive
Kronoton’s HDSX High Definition Sound Expansion lets the listener dive into the dynamic, multidimensional complexity of listening, providing music in its natural space, weighted ideally to its direction. - Audio Post-Processing for Mobile Devices - Dolby® DS1
Dolby DS1 for Digital Plus provides mobile users with home theater-inspired sound quality by enabling audio/voice boost and by compensating for unintelligible dialogue, extreme volume variation, and deficiencies inherent in the small speakers and low-power amplifiers on most mobile devices. - A leading brand game console
Gaming audio and voice processing demo using the Tensilica HiFi Audio DSP. - Wi-Fi 802.11ac
The CES 2014 schedule includes, in collaboration with RivieraWaves, a joint demonstration of WiFi 802.11a/b/g/n/ac PHY and MAC for programmable multi-standard next-generation connectivity solutions. - Computer Vision and Imaging Analytics
The Cadence Tensilica IVP imaging/video DSP will be demonstrated running computer vision and imaging algorithms.
WHEN:
Tuesday, January 7, through Friday, January 10, 2014
WHERE:
Las Vegas Convention Center, South Hall, Ground Floor, Meeting Room MP25060
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- CEVA Addresses the Next Trends in Mobile, Digital Home and Automotive at CES 2014 with Range of Platform IP Solutions for SoC Design
- New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets
- Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications
- Cadence Unveils Industry's First Neural Network DSP IP for Automotive, Surveillance, Drone and Mobile Markets
- CEVA to Showcase Latest DSPs and Platform IPs for Mobile, Digital Home and Automotive at CES 2013
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |