English
HP lays off 5,000 more employees
Zewde Yeraswork, EETimes Europe
January 02, 2014
Hewlett-Packard on Tuesday announced that it would cut 5,000 additional jobs after already having layed off 29,000 workers earlier this year.
According to a report from Reuters, the latest round of layoffs, announced on New Year’s Eve, will bring the total percentage of the company’s workforce that has been trimmed to 11 percent.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Arm China lays off 14% of staff
- Broadcom lays off 1,100; may lay off more
- AMD Cuts 5% of Global Employees
- Smart Power Metering: Dolphin Integration first Silicon IP provider to announce range 1/5,000 with 0.05 % accuracy for a complete solution
- Smart Grid - Power metering: Dolphin Integration achieves range 1/5,000 with class 0.1 on silicon
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X