Wafer Stacking Technology Promises Faster, Denser System-On-a-Chip (SOC)
Tachyon Semiconductor and Los Alamos National Laboratories Explore Applications
Naperville, IL - June 10, 2002 - A novel wafer-stacking process developed by Tachyon Semiconductor offers unprecedented speed and density advantages for multi-functional "System-On-a-Chip" (SOC) devices. These advantages have attracted the attention of Los Alamos National Laboratories, resulting in an agreement to explore and define the production of 3-D integrated devices.
At present, SOC devices are manufactured by building many different types of circuitry onto a single silicon wafer. Forcing disparate elements onto one wafer invariably leads to process compromises and prevents any meaningful optimization. Tachyon's wafer stacking process allows different circuitry elements to be built on several separate wafers, each wafer fully optimized for its specific components. The finished wafers are stacked, bonded, and interconnected with thousands of through-silicon "vias" to create a fully integrated device. This process was labeled as a "top new technology" in Electronic Design magazine's 2002 Top Ten Forecast.
Tachyon Semiconductor Corporation has been sub-contracted by the University of California and Timension Inc. (of Mountainview, CA) to adapt its technology for use in devices being developed by the US Department of Energy's Los Alamos National Laboratories (LANL). Under the agreement, Tachyon will produce a report detailing the production of an SOC device with separate layers for the microprocessor, flash memory, FPGA (programmable logic), and DRAM (mass memory).
Scott Johnston, Tachyon's Director of Engineering, states: "Our team is thrilled to be working with an organization like Los Alamos National Laboratories. Their reputation as one of the world's premier research and development labs makes it especially exciting for us to be helping them to apply our stacking technology."
Tachyon Semiconductor Corporation is a privately held fabless semiconductor and engineering design services company that has developed significant intellectual property concerning stacked memory and SOC integrated circuits. To find out more about Tachyon's technology, check out www.tachyonsemi.com on the World Wide Web.
|
Related News
- System-on-a-Chip (SoC) Market to Exceed $58 Billion by 2010, According to a New Report by Global Industry Analysts, Inc.
- Broadcom Debuts Industry's First Digital Cable Set-Top Box System-on-a-Chip (SOC) With HD AVC/VC-1 Decoding, Channel Bonding and Downloadable Security
- Micron Introduces VGA-size ultra low-power CMOS image sensor camera System-on-a-Chip (SoC) devices
- DSP GROUP INC. Unveils a new system-on-a-chip (S.O.C.) Solution for digital voice recorders and digital music players
- Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes
Breaking News
- Alphawave Semi Audited Results for the Year Ended 31 December 2024
- BrainChip Gives the Edge to Search and Rescue Operations
- Shifting Sands in Silicon by Global Supply Chains
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- Equal1 advances scalable quantum computing with CMOS-compatible silicon spin qubit technology
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Intel Announces Strategic Investment by Silver Lake in Altera
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- AMD Achieves First TSMC N2 Product Silicon Milestone
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |