GNSS (GPS, Galileo, GLONASS, Beidou3, QZSS, SBAS) Ultra-low power RF Receiver IP
FDSOI Gains Design Wins Amid Fab Partner Mystery
Peter Clarke, Electronics360
28 January 2014
European chip company STMicroelectronics NV is gaining design wins for its 28nm fully depleted silicon-on-insulator (FDSOI) manufacturing process but is being coy about who will be its initial partner for high volume manufacturing. The date for the start of second-source volume manufacturing of FDSOI chips also appears to have slipped.
Jean-Marc Chery, executive vice president and general manager of embedded processing solutions at ST, told Electronics 360 that the number of FDSOI IC designs in development has risen to 15. That number stood at three about eight months ago. But he also declined to discuss progress at Globalfoundries in bringing up high volume manufacturing capacity of FDSOI chips.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
- Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
- TSMC could partner with Bosch for 28nm fab in Germany
- Cadence Wins Six 2022 TSMC OIP Partner of the Year Awards
- Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era