IBM invests in new $5bn chip fab in India, so is chip sale off?
Richard Wilson, Electronics Weekly
February 14, 2014
India is to get a $10bn semiconductor wafer fab investment and one of the investors is IBM, recently rumoured to be considering an exit from all chip-making. This investment in an Indian mega-fab would seem to throw cold water on this move. India’s government at approved the building of two semiconductor wafer fabs by a group of chip firms including IBM, TowerJazz and STMicroelectronics. IBM remains a key source of manufacturing technology for many companies, so a suggestion that it may pull out of the business sent a shockwave through the industry earlier this month.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- SkyWater Begins Domestic Fab Expansion Tool Installation to Support DOD Investment of up to $170M
- Fabs Valued at Nearly $50 Billion to Start Construction in 2020
- Intel Supports American Innovation with $7 Billion Investment in Next-Generation Semiconductor Factory in Arizona
- Bessemer Venture Partners Invests $15 Million in Kandou
- Could India's Analog Wafer Fab be Moving South?
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation