intoPIX Demonstrates First TICO Lightweight Compression Technology Running on FPGA Hardware at NAB 2014
BELGIUM, Mont-Saint-Guibert -- March 18, 2014 -- At the upcoming NAB show, intoPIX (booth C5243) is showcasing the first hardware implementation of the TICO patent-pending lightweight disruptive compression technology running on FPGA. Without any usage of external memory and with an incredibly low footprint, TICO FPGA IP-cores provide a lightweight visually lossless compression up to 4:1, with a fixed latency of few pixel lines for HD, 4K or 8K. This new advanced image and video compression algorithm is designed to efficiently and invisibly tackle important cost and bandwidth challenges faced by our industry.
“Our industry needs smart ways to handle more HD streams and move to 4K or 8K with cost and power savings. It is not possible to increase storage, bandwidth and video buffer capacity everywhere,” says Gael Rouvroy, intoPIX Chief Technology Officer. “Using TICO lightweight compression in FPGA, we are able to achieve higher performance with lower cost infrastructure and systems. TICO is designed to be a standard for the industry-wide support and can easily map 4K video in 3G-SDI or 10GbE network for instance.”
The first ultra-low-footprint encoder and decoder (IPX-TC-UHD4K)that will be presented at NAB will compress any resolutions from HD up 4K resolution at 60 FPS with lossless visual quality up to 4:1 at a maximum latency of 8 pixel lines. A second lightweight IP-core version will perform mathematically lossless video frame buffer compression-decompression (IPX-TC-MLS): given that image resolutions continue to increase and more image data need to be transferred, bandwidth reduction is becoming a very important issue in video processing.
The NAB demonstrations feature a Xilinx Kintex-7- board and an Altera Cyclone V board running the current FPGA development of the TICO technology. intoPIX welcomes everybody at its booth to discover the new TICO compression and enjoy the first FPGA and technology demos.
About intoPIX
intoPIX is a leading supplier of video and image compression technology to audiovisual equipment manufacturers. We are passionate about offering people a higher quality image experience and have developed FPGA IP-cores and solutions that enable leading-edge video and image compression, security and hardware enforcement. More product information about TICO compression can be found on www.intopix.com/TICO
|
intoPIX Hot IP
Related News
- intoPIX demonstrates TICO implemented SMPTE 2110 IP running 4K live on FPGA CPU and GPU
- Media Links Integrates TICO Lightweight Compression into its MDP Series
- Nevion integrates TICO lightweight compression into its Virtuoso product line.
- intoPIX showcases UHDTV Hybrid SDI/IP Interoperability using TICO lightweight compression at the SMPTE 2015 Annual Technical Conference and Exhibition.
- TICO Lightweight Compression Shortlisted "Finalist for the IABM Game Changer Awards 2015" at NAB 2015.
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |