English
Bluetooth Smart's Rise From Obscurity to Mainstream
Teardown.com
EETimes (3/28/2014 07:00 PM EDT)
Beyond mobile phones, Bluetooth Smart is really empowering designers and architects of the Internet of Things. At TechInsights' Teardown.com, we tear down nearly 400 devices a year. Over the past three years, we have seen Bluetooth Smart go from obscurity to mainstream in mobile devices and become a standard in wearable and wellness technology research.
Given this, Teardown.com decided to take a quick look at the Bluetooth Smart adoption rate in the consumer electronic devices we have analyzed.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash
- Fudan Microelectronics Group Selects Synopsys' DesignWare Bluetooth IP for Smart IoT System-on-Chips
- Imagination's Ensigma communications IP receives Wi-Fi CERTIFIED ac certification and Bluetooth Smart qualification
- CEVA's Bluetooth Low Energy IP Powers NXP QN9000 Series of Bluetooth Smart SoCs
- Sunrise Micro Devices' Radio Technology Enables Internet Capable Bluetooth Smart IoT Devices
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards