Rambus Responds to FTC Administrative Complaint
LOS ALTOS, Calif., June 19, 2002 - Rambus Inc. (NASDAQ:RMBS) today responded to the Federal Trade Commission's filing of an administrative complaint relating to Rambus' 1992-1995 participation in an industry standard setting committee, the Joint Electron Device Engineering Council ("JEDEC").
The FTC's complaint stems from the same facts and the same core allegations as are currently being litigated in multiple private lawsuits, including the Infineon case, tried last year in Virginia, for which an appeal was heard before the United States Court of Appeals for the Federal Circuit on June 3, 2002. Two United States District Courts - those hearing the Micron and Hynix cases - have delayed their cases pending resolution of the Infineon appeals.
"These cases all derive from the same facts. They all involve the same core issue of whether Rambus complied with JEDEC rules, which may or may not have shifted over time, and appropriately disclosed its patent interests in the 1992-1995 time frame," stated John Danforth, senior vice president and general counsel for Rambus Inc. "Given that the United States Court of Appeals for the Federal Circuit is currently scrutinizing this matter, we are somewhat surprised to see this complaint by the FTC."
Rambus first filed a patent application for its revolutionary memory technology in 1990 and proceeded to teach the industry how to apply that technology, while protected by nondisclosure agreements. By invitation, Rambus later joined a JEDEC committee that was developing a DRAM standard. Today, Rambus' industry-leading chip-to-chip interface technology can be found in dozens of products including personal computers, servers, workstations, video game consoles, high-definition TVs, set-top boxes and networking routers and switches.
"We believe we have established that Rambus fully complied with JEDEC's disclosure policy and that Rambus had no undisclosed patents, or even applications, during the relevant time period that read on any proposed JEDEC standard," explained Danforth. "At the end of the day, we believe that the FTC process, either at the administrative level or on appeal, will conclude that our actions were entirely appropriate and lawful."
About Rambus Inc.
Rambus is the leading developer and marketer of breakthrough chip-to-chip interface technology, products and solutions to the electronics industry. The company licenses its technology in the form of ASIC cells that are incorporated into high-performance memory and logic chips by 25 of the world's top semiconductor makers. The company's ASIC cells and system-level solutions are incorporated into hundreds of unique electronic products.
|
Related News
- Qualcomm Takes on the World, in Court
- InterDigital Responds to Reports of Huawei European Commission Complaint
- Sonics Responds to Arteris Complaint
- Rambus Files ITC Complaint against Broadcom, Freescale, LSI, MediaTek, NVIDIA and STMicroelectronics
- ITC Administrative Law Judge Rules in Favor of Rambus in Matter Regarding NVIDIA Products
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |