7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Embedded memory startup T-RAM receives $35 million in funding
![]() |
Memory startup T-RAM receives $35 million in funding
By Semiconductor Business News
June 20, 2002 (6:09 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020620S0037
SAN JOSE -- Memory startup T-RAM Inc. here today announced it has received $35 million in its second round of financing. The total capitalization for the Sunnyvale-based company is about $46 million. Investors in the company include New Enterprise Associates, Mayfield, US Venture Partners and Tallwood Venture Capital. Kenneth Young, CEO of T-RAM, said the funding would help bring the company's high-performance SRAM memory technology to market. T-RAM is a two-year-old company that is developing a novel SRAM technology. T-RAM's SRAM technology will address discrete and embedded applications.
Related News
- AI Processor Chipmaker Deep Vision Raises $35 Million in Series B Funding
- Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications
- Spin Memory Announces $52 Million Series B Funding Round
- Hailo Raises $12.5 Million Series A Round to Develop Deep Learning Processor for Embedded AI Applications
- Crossbar Closes Series D Funding of $35 Million
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |