Sidense 1T-OTP NVM Qualified in Second-Generation TSMC 180nm BCD Process
Update: Synopsys Expands DesignWare IP Portfolio with Acquisition of Sidense Corporation (Oct. 17, 2017)
Ottawa, Canada – (April 30, 2014) - Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that the Company's 1T-OTP macros for TSMC's 180nm BCD 1.8/5.0V Gen 2 process have met all TSMC9000 Assessment program requirements. Sidense OTP macros, at this process node, support applications such as automotive and industrial electronics that require reliable operation and long-life data retention in high-temperature environments. Customers are using Sidense Automotive Grade OTP in a wide range of devices, including power-management ICs, sensors and microcontrollers for applications in automotive, industrial, mobile and consumer devices and systems.
"In April of 2013, we announced meeting TSMC9000 requirements for TSMC 180nm BCD Gen 1," said Tom Schild, Sidense VP of Sales and Marketing. "Providing support for both Gen 1 and Gen 2 reflects Sidense's commitment to its customers, TSMC and the ever-growing requirement for the BCD process."
Sidense Automotive Grade 1T-OTP macros completed full qualification for High-Temperature Operating Life (HTOL) at -40ºC to 150°C and Data Retention Storage Life (DRSL) to 2000 hours at 150°C. This level of qualification was completed to support customers requiring devices to conform to AEC-Q100 Grade 0 specifications and provide data retention over the full operating temperature range, at full duty cycle, for more than 10 years.
Macros are available in a comprehensive range of off-the-shelf configurations supporting small densities of 256 bits for configuration and trim applications, up to 256 Kbits per macro for code storage and multiple NVM uses. Automotive Grade 1T-OTP provides many advantages, including small footprints to minimize cost, field-programmability, configurations with word widths up to 128 bits and fast read access to allow executing code from OTP for many applications.
About Sidense Corp.
Sidense Corp. provides very dense, highly reliable and secure non-volatile one-time programmable (OTP) Logic Non-Volatile Memory (LNVM) IP for use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-OTP macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming and device configuration uses.
Over 120 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-OTP as their NVM solution for more than 360 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.
|
Related News
- Sidense 1T-OTP NVM Qualified for 150 Degrees C Automotive High-Reliability Requirements on TSMC's BCD Process
- Sidense Demonstrates Successful 1T-OTP Operation in TSMC 16nm FinFET Process
- Sidense 1T-OTP Memory Macros meet JEDEC Accelerated Testing Qualifications at Two TSMC 28nm Process Nodes
- Sidense Qualifies 1T-OTP Non-Volatile Memory for MagnaChip 180nm Mixed-Signal and HV CMOS Process
- Sidense Exhibiting its 1T-OTP Memory Solutions at TSMC Open Innovation Platform (OIP) Ecosystem Forum
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |