Wearable SoC: Let DSP Do 'Always Listening' Chores
Ceva makes the case with multifunction DSP
Junko Yoshida, EETimes
5/7/2014 07:55 PM EDT
MADISON, Wis. — Wearable devices are suffering from a fatal flaw: batteries that die too fast. Developers blame the problem on the dearth of tailor-made wearable SoCs that could meet their requirements.
With that in mind, if they were to develop their own wearable SoCs, what should be their priority?
On a system level, system designers first and foremost need to rethink displays. Will Strauss, president of Forward Concepts, said the biggest power drain in a cellphone is the screen. Switching "to black and white to save power when color is not needed" is one idea. Other power wasters include "keeping WiFi on when you're not near a hotspot."
On a silicon level, Linley Gwennap, principal analyst at Linley Group Inc., calls "higher power in the application processor" the main culprit in power drain. "Processors with four or eight cores, particularly big cores, are much more power hungry than the single- and dual-core processors from a couple of years ago." Choosing a low-power processor (CPU and/or DSP) combined with wireless communications (e.g., Bluetooth, WiFi, cellular) should be a high priority in wearable SoCs, he says.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Ceva, Inc. Hot IP
Related News
- Novatek Adopts CEVA's Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC
- Quadric's New Chimera GPNPU Processor IP Blends NPU and DSP into New Category of Hybrid SoC Processor
- CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
- InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
- Recore Systems and CRC partner to port high velocity digital radio L-band listening to Recore's DSP application platform
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset