HiSilicon Expands Cadence Palladium XP Platform Usage For Mobile and Digital Media SoC and ASIC Development
SAN JOSE, Calif., 12 May 2014 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that HiSilicon further expanded usage of the Cadence® Palladium® XP Verification Computing Platform as its emulation solution for mobile and digital media System-on-Chip (SoC) and ASIC development.
HiSilicon provides ASICs and SoCs for communication network and digital media, including solutions for network surveillance, videophones, Digital Video Broadcast and IPTV. Solutions for these markets require a high level of quality, with robust hardware-software verification, and a quick turn-around time to meet aggressive time-to-market needs.
“We expanded our usage of the Palladium XP platform due to its performance, flexibility, hardware and software co-development efficiency and ability to shorten the time to market for our designs,” said Yanqiu Diao, deputy GM, Turing Processor Business Unit at HiSilicon. “The power verification and analysis capabilities of Palladium XP are also a good match for our increasing number of low power mobile designs.”
Part of the Cadence System Development Suite, the Palladium XP platform is the industry’s first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. For more information on the Palladium XP platform, visit www.cadence.com/news/pxp.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
|
Cadence Hot IP
Related News
- Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market
- Altair Semiconductor Adopts Cadence Palladium XP Platform for Advanced IoT SoC Development
- Spreadtrum Adopts Cadence Palladium XP II Platform for Mobile SoC and Hardware-Software Verification
- Ricoh Selects Cadence Palladium XP Platform for Next-Generation Multifunction Printer SoC Development
- Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |