HiSilicon Expands Cadence Palladium XP Platform Usage For Mobile and Digital Media SoC and ASIC Development
SAN JOSE, Calif., 12 May 2014 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that HiSilicon further expanded usage of the Cadence® Palladium® XP Verification Computing Platform as its emulation solution for mobile and digital media System-on-Chip (SoC) and ASIC development.
HiSilicon provides ASICs and SoCs for communication network and digital media, including solutions for network surveillance, videophones, Digital Video Broadcast and IPTV. Solutions for these markets require a high level of quality, with robust hardware-software verification, and a quick turn-around time to meet aggressive time-to-market needs.
“We expanded our usage of the Palladium XP platform due to its performance, flexibility, hardware and software co-development efficiency and ability to shorten the time to market for our designs,” said Yanqiu Diao, deputy GM, Turing Processor Business Unit at HiSilicon. “The power verification and analysis capabilities of Palladium XP are also a good match for our increasing number of low power mobile designs.”
Part of the Cadence System Development Suite, the Palladium XP platform is the industry’s first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. For more information on the Palladium XP platform, visit www.cadence.com/news/pxp.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
|
Cadence Hot IP
Related News
- Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market
- Altair Semiconductor Adopts Cadence Palladium XP Platform for Advanced IoT SoC Development
- Spreadtrum Adopts Cadence Palladium XP II Platform for Mobile SoC and Hardware-Software Verification
- Ricoh Selects Cadence Palladium XP Platform for Next-Generation Multifunction Printer SoC Development
- Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |